China has already taken action in all walks of life to make automated welding technology a strategic goal. Laser welding machines have also become the standard for some high-end industrial production and processing enterprises. So in the process of their use, how should we carry out laser welding machines? What about maintenance?

In the process of maintenance and repair, it is recommended that you invite trained professionals to carry out the operation to avoid unnecessary trouble. The specific laser welding machine maintenance and maintenance operations are as follows:

1. In order to ensure that the laser has been in a normal working state, after working continuously for two weeks or after stopping for a period of time, before starting the machine, the components in the optical path such as the YAG rod, dielectric diaphragm and lens protection glass should be checked to determine each optical There are no abnormal phenomena such as dust pollution and mildew. The above phenomena should be dealt with in time to ensure that the optical components will not be damaged under strong laser irradiation.

2. The equipment operator can often check the laser output light spot with black photo paper. Once the spot light is uneven or the energy drops, the laser resonator should be adjusted in time to ensure the quality of the laser output beam.

3. In use, the conductivity of the internal circulating water should be checked once a week to ensure that its electrical conductivity is 30.5MW.cm. The internal circulating deionized water must be replaced once a month. The conductivity of the newly injected pure water must be 32MW.cm at any time. Observe the color change of the ion exchange column in the cooling system. Once the color of the resin in the exchange column changes to dark brown or even black, the resin should be replaced immediately.

Laser welding machines are widely used in the electronics industry, especially in the microelectronics industry. Due to the small heat-affected zone of laser welding, rapid heating concentration, and low thermal stress, it shows unique advantages in the packaging of integrated circuits and semiconductor device housings.